The Compact, Automated V3

V3 product design offers dry-to-dry processing, low exhaust requirements, few facility connections and easy maintenance access, while maintaining as much as a 20 percent footprint reduction over comparable tool sets.

The V3 robot is designed to handle solar silicon and 150 or 200mm wafers in standard cassettes for IC devices; alternate cassettes allow other materials to be processed using the standard robot arm. It is particularly well suited to MEMS cleaning and etching applications.

V3 Features:

• Small footprint batch-immersion system (S2/S8/FM/CE compliant) — dry-to-dry process
• 3 position, 2 axis rotary robot for accurate placement
• Interlocked pull-out electrical cabinet for easy access; full vertical access rear or front plumbing maintenance access
• Windows 2000 O/S, SECSII & GEM interface standard; ethernet based I/O & communication for reliable operation
• Graphical User Interface (GUI); automatic computer controlled operation
• Full scheduling; data-logging

Safety Features

• LED stack light with audible alarm
• Ergonomic color LCD monitor, keyboard & pointing device
• Interlocked automatic shield and easily accessed EMO/EPO buttons
• Advanced seismic bracing and rack-mounted components
• Easy reach distribution valving and plumbing accessibility
• Rear access leak detection
• UL 489 Rated Main Disconnect Switch
• FM 4910 Materials of Construction